Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Means assembling part within hole or aperture
Patent
1978-06-01
1980-06-10
Silbaugh, Jan H.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Means assembling part within hole or aperture
156556, 425523, 425526, 425530, 425533, 425534, B32B 100, B29D 300, B29C 1707
Patent
active
042071348
ABSTRACT:
Apparatus for the preparation of hollow plastic articles wherein a more rapid operating cycle is obtained with less effect upon the temperature of the parison. The apparatus includes a first core, means for providing a parison thereon, a temperature controlled first mold engageable with said first core and parison, means for separating the first core from the first mold and parison contained therein, a second core in spaced relationship to the first core, means for transferring the parison to the second core, a blow mold in spaced relationship to said first mold for fully expanding the parison and means for transferring the second core and parison to the blow mold, wherein the blow mold is stationary and the second core with parison thereon is brought into alignment with the blow mold and is inserted therein.
REFERENCES:
patent: 3032823 (1962-05-01), Sherman
patent: 3722725 (1973-03-01), Khetani et al.
patent: 3759686 (1973-09-01), Trahan
patent: 3819314 (1974-06-01), Marcus
patent: 3927782 (1975-12-01), Edwards
patent: 3948404 (1976-04-01), Gollins et al.
patent: 3966378 (1976-06-01), Valyi
patent: 4066726 (1978-01-01), Mehnert
LandOfFree
Apparatus for the preparation of hollow plastic articles does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for the preparation of hollow plastic articles, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for the preparation of hollow plastic articles will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-861340