Apparatus for the manufacture of tubular bodies of semiconductor

Details Apparatus for the manufacture of tubular bodies of semiconductor Apparatus for the manufacture of tubular bodies of semiconductor

1976-02-18

1977-04-05

Lazarus, Richard B.

Plastic article or earthenware shaping or treating: apparatus

Shaping or casting surface

Endless shaping surface

425470, B29D 2300

Patent

active

040159221

ABSTRACT:
For the manufacture of tubular bodies of semiconductor material, particularly of silicon, by the precipitation of a layer in the form of a hollow cylinder on a rod or tube-shaped,electrically heated carrier in a reaction gas suitable for the deposition of the semiconductor in question, with subsequent separation of the semiconductor layer from the carrier, the carrier is differentially heated in such a manner that the generated hollow-cylinder layer is given an annular, bead-like reinforcement; the separation of the tube obtained into parts is achieved by a cut made within the reinforcement.

REFERENCES:
patent: 3014791 (1961-12-01), Benzing et al.
patent: 3746496 (1973-07-01), Dietze et al.
patent: 3747559 (1973-07-01), Dietze et al.
patent: 3943218 (1976-03-01), Dietze et al.

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