Apparatus for the heat treatment of powdery material

Details Apparatus for the heat treatment of powdery material Apparatus for the heat treatment of powdery material

1986-01-23

1988-04-12

Silbaugh, Jan H.

Drying and gas or vapor contact with solids

Apparatus

With apparatus using centrifugal force

264 15, F26B 1700, B22D 1101

Patent

active

047365277

ABSTRACT:
A method and apparatus for the heat treatment of a powdery material wherein a flow-circling chamber circles round a powdery material-dispersing airflow and subsequently blows the airflow from a circling flow-blowing nozzle round in the proximity of the inside wall of the flow-circling chamber forming a hollow cone flow. A heated airflow conducting means concurrently applies a heated airflow to the periphery of the hollow cone flow and the material-dispersing airflow is conducted into a heat-treatment chamber wherein the heated airflow is conducted in the same direction as the circling direction of the hollow cone flow.

REFERENCES:
patent: 2929106 (1960-03-01), Snow
patent: 2972221 (1961-02-01), Wilke et al.
patent: 3129086 (1964-04-01), Veatch et al.
patent: 3154603 (1964-10-01), Witheford
patent: 3190737 (1965-06-01), Schmidt
patent: 3323888 (1967-06-01), Searight et al.
patent: 3566612 (1971-02-01), Eilenberg et al.
patent: 3632257 (1972-01-01), Ashizawa
patent: 3632778 (1972-01-01), Sheth et al.
patent: 4137188 (1979-01-01), Uetake et al.
patent: 4164534 (1979-08-01), Ogino
patent: 4212837 (1980-07-01), Oguchi et al.
patent: 4243794 (1981-01-01), White et al.
patent: 4246208 (1981-01-01), Dundas

Affiliated with

Also associated with

Rating

Apparatus for the heat treatment of powdery material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for the heat treatment of powdery material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for the heat treatment of powdery material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1421756