Apparatus for the exact mutual alignment of a mask and semicondu

Radiant energy – Means to align or position an object relative to a source or...

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2504922, 2504421, 250548, 378 34, 356400, G01N 2300

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048250864

ABSTRACT:
An arrangement and method for the exact, mutual alignment of a mask and a semiconductor wafer in a lithographic apparatus so that the mask and wafer are in a plane extending perpendicular to the particle beam. The apparatus includes a seating arrangement for the mask having a first retaining part and arrangement for positioning this first retaining part relative to a table which allows adjusting the plane of the first retaining part. The apparatus also includes a second retaining part for securing the wafer thereto, which second retaining part is mounted on the plate by an arrangement that allows adjusting the plane of the second retaining part relative to the axis so that the surface of the semiconductor wafer can also be placed in a plane extending perpendicular to the beam direction.

REFERENCES:
patent: 4238780 (1980-12-01), Doemens
patent: 4253112 (1981-02-01), Doemens
patent: 4472824 (1984-09-01), Buckley
patent: 4525852 (1985-06-01), Rosenberg
patent: 4746800 (1988-05-01), Van Eijk et al.
Folchi et al, "X-Ray Lithography Mask Alignment Stage", IBM Technical Disclosure Bulletin, vol. 25, No. 12, May 1983, pp. 6400-6401.
Muller et al, "Overlay Measurements for X-Ray Lithography", J. Vac. Sci. Technol., B 3(1), Jan./Feb. 1985, pp. 241-244.

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