Apparatus for the elimination of edge growth in liquid phase epi

Coating apparatus – Immersion or work-confined pool type – Work-confined pool

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118415, 118421, B05C 3109, H01L 21208

Patent

active

044125020

ABSTRACT:
An apparatus for substantially eliminating excessive edge growth in liquid phase epitaxy utilizing a substrate carrier 11 and a source material carrier 13 slidable over the substrate carrier 11 including a well 24 around a recess 14 in the substrate carrier 11 wherein the substrate 16 is held. The well 24 contains a material therein which reduces the heat loss from the edges of the substrate 16 held in the recess 14 thereby reducing excessive epitaxial growth around the edges of the substrate 16.

REFERENCES:
patent: 3051555 (1962-08-01), Rummel
patent: 3565702 (1971-02-01), Nelson
patent: 3589336 (1971-06-01), Bergh
patent: 3697330 (1972-10-01), Minden et al.
patent: 3767481 (1973-10-01), Ettenberg et al.
patent: 3821039 (1974-06-01), Ettenberg
patent: 3854447 (1974-12-01), Kobayashi
patent: 3859148 (1975-01-01), Dawson et al.
patent: 3890194 (1975-06-01), Ettenberg
patent: 3933538 (1976-01-01), Akai et al.
patent: 3950195 (1976-04-01), Rode et al.
patent: 4032370 (1977-06-01), Matare
patent: 4047986 (1977-09-01), Hanoka
patent: 4160682 (1979-07-01), Esseluan
patent: 4261770 (1981-04-01), Splittgerber et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for the elimination of edge growth in liquid phase epi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for the elimination of edge growth in liquid phase epi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for the elimination of edge growth in liquid phase epi will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2165104

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.