Apparatus for the cooling of electronic assemblies or components

Details Apparatus for the cooling of electronic assemblies or components Apparatus for the cooling of electronic assemblies or components

1985-06-27

1986-09-23

Davis, Jr., Albert W.

Heat exchange

Thermosyphonic flue type

Heating or cooling means within distinct flue forming enclosure

165122, 361383, 361384, 62418, H01L 2346

Patent

active

046129790

ABSTRACT:
For the cooling of electronic assemblies or components which are accommodated in slide-in circuits disposed one above the other in a rack, cooling air is supplied to the individual slide-in circuits from the respective underside thereof, which after having been heated by the respective slide-in issues therefrom as warm air. On the rack underside and on at least one rack side and/or on the back of the rack a channel arrangement is provided which is connected with a cooling air supply system provided on the rack underside and which is in communication with the open undersides of all slide-ins for the uptake of cooling air.

REFERENCES:
patent: 3387648 (1968-06-01), Ward, Jr. et al.
patent: 3701928 (1972-10-01), Davis
patent: 3730264 (1973-05-01), Krylow et al.
patent: 3874444 (1975-04-01), Perce et al.
Hwang et al, IBM Technical Disclosure Bulletin, vol. 22, No. 2, 7/1979, pp. 696, 697.

Affiliated with

Also associated with

Rating

Apparatus for the cooling of electronic assemblies or components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for the cooling of electronic assemblies or components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for the cooling of electronic assemblies or components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-760870