Abrading – Machine – Rotary tool
Patent
1997-08-14
1999-10-12
Scherbel, David A.
Abrading
Machine
Rotary tool
451254, 451258, B24B 500, B24B 2900
Patent
active
059646527
ABSTRACT:
An apparatus for the chemical-mechanical polishing of wafers has a rotating disk provided with a polishing body, a supply device for a polishing fluid and a holding device for the wafer. An axis of the disk runs parallel to the surface of the wafer. A cylindrical edge surface of the disk is provided with the polishing body in such a way that a trench with a specific cross section can be made in the wafer.
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Japanese Patent Abstract No. 55-58984, dated May 2, 1980.
Melzner Hanno
Wendt Hermann
Banks Darris Holt
Greenberg Laurence A.
Lerner Herbert L.
Scherbel David A.
Siemens Aktiengesellschaft
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