Apparatus for the application of solder to workpieces

Coating apparatus – With heat exchange – drying – or non-coating gas or vapor... – Plural treatments

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118 63, 118 69, 118206, 118302, 118304, 118404, 118425, B05C 310

Patent

active

045639744

ABSTRACT:
A soldering technique is provided especially for printed circuit boards wherein a bath of solder assisting fluid such as non-ionic surface active agent is superposed on a bath of solder. In one form, the workpiece is passed through the bath of solder assisting fluid and solder is pumped from the bath of solder to a trough whereat the solder is cascaded onto the workpiece. In another form, the workpiece is passed downwardly through the bath of solder assisting fluid into the bath of solder for the application of solder to the workpiece. Thereafter, the workpiece is withdrawn from the bath of solder through the bath of solder assisting fluid. In both instances, while the workpiece is still within the bath of solder assisting fluid, jets of this fluid are played against the workpiece to control the thickness of the solder which is allowed to remain on the workpiece. This is accomplished by immersion of fluid levelling knives in the bath of solder assisting fluid with jets being played by these knives onto the workpiece. In addition, provision is made for air blowing the workpiece to remove the solder assisting fluid therefrom. Thereafter, the workpiece is cooled, rinsed and dried.

REFERENCES:
patent: 2370495 (1945-02-01), Sebell
patent: 3190527 (1965-06-01), Tardoskegyi
patent: 3893409 (1975-07-01), Rote
patent: 3924794 (1975-12-01), Allen et al.
patent: 4315042 (1982-02-01), Spigarelle

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