Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1988-02-12
1989-07-18
Jordan, M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
2281801, H05K 334
Patent
active
048486400
ABSTRACT:
An apparatus for the application of a conductive adhesive medium in a fluid state to a side of a printed circuit board bearing electronic components is disclosed. The apparatus generally comprises a hollow shaft standing in a supply tank for the adhesive medium in an obliquely rising conveyor belt for at least one circuit board at a time. The upper end of the hollow shaft has two overflow edges arranged perpendicularly to the direction of transport for the formation of a wave, through the crest of which the side of the card previously moistened with a flux, is passed.
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Jordan M.
Soltec B.V.
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