Apparatus for testing semiconductor integrated circuit...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S1540PB

Reexamination Certificate

active

06876215

ABSTRACT:
Apparatus for testing semiconductor integrated circuit devices in wafer form includes a test head, a probe card support mechanism attached to the test head for supporting a probe card beneath the test head, a wafer prober for presenting successive wafers to be tested to the test head from beneath the test head, and a lifting mechanism attached to the wafer prober for lifting the test head above the wafer prober. Upon lifting the test head above the wafer prober, the probe card support mechanism can move horizontally relative to the test head between an inserted position in which the probe card support mechanism is positioned to enable the probe card to engage contact elements of the test head and an extended position in which the probe card can be removed from the probe card support mechanism.

REFERENCES:
patent: 5274575 (1993-12-01), Abe
patent: 5528158 (1996-06-01), Sinsheimer et al.
patent: 5594357 (1997-01-01), Nakajima
patent: 5754057 (1998-05-01), Hama et al.
patent: 5798651 (1998-08-01), Aruga et al.
patent: 5804983 (1998-09-01), Nakajima et al.

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