Apparatus for testing bumped die

Details Apparatus for testing bumped die Apparatus for testing bumped die

2005-08-09

2005-08-09

Zarabian, Amir (Department: 2822)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S755090, C324S765010, C324S754090, C324S758010

Reexamination Certificate

active

06927589

ABSTRACT:
An apparatus for testing unpackaged semiconductor dice having raised ball contact locations is disclosed. The apparatus uses a temporary interconnect wafer that is adapted to establish an electrical connection with the raised ball contact locations on the die without damage to the ball contact locations. The interconnect is fabricated on a substrate, such as silicon, where contact members are formed in a pattern that matches the size and spacing of the ball contact locations on the die to be tested. The contact members on the interconnect wafer are formed as either pits, troughs, or spike contacts. The spike contacts penetrate through the oxide layer formed on the raised ball contact locations. Conductive traces are provided in both rows and columns and are terminated on the inner edges of the walls of the pits formed in the substrate.

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