Apparatus for testing a bonding position of a bonding wire

Details Apparatus for testing a bonding position of a bonding wire Apparatus for testing a bonding position of a bonding wire

1995-10-04

1998-04-28

Razavi, Michael T.

Image analysis

Applications

Manufacturing or product inspection

382205, 382257, G06J 530

Patent

active

057455945

ABSTRACT:
An imaging device for imaging an object is situated above the object. A downward-illumination device for emitting light to the object is situated as one unit with the imaging device. A background-illumination device for emitting light to the object is situated below the object. An image obtained by the imaging device is stored in a memory unit of an image processing apparatus. The image processing apparatus includes a processing unit for logically processing the image. The illumination devices are connected to power supplies. The image processing apparatus and the power supplies are controlled by a controller. Thus, a bonding position is recognized easily with simple structure, the reliability of test results is enhanced, and the cost for testing is reduced by a decrease in the processing time.

REFERENCES:
patent: 4972493 (1990-11-01), Chemaly
patent: 4975972 (1990-12-01), Bose et al.
patent: 5161202 (1992-11-01), Kitakado et al.
patent: 5170062 (1992-12-01), Miyahara
patent: 5214712 (1993-05-01), Yamamoto
patent: 5225891 (1993-07-01), Choumei
patent: 5298989 (1994-03-01), Tsukahara et al.
Tsukahara et al. "Automated Visual Inspection System for Bonded IC Wires." Fujitsu Sci Tech J. vol. 28, No. 1, Spring 1992, pp. 107-114.
Baxes, Digital Image Processing; Principles and Applications, John Wiley & Sons, Inc., 1994, pp. 129-137.
Low, "Introductory Computer Vision and Image Processing." McGraw-Hill Book Company, 1991, pp. 100-108.

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