Apparatus for tape automated bonding

Details Apparatus for tape automated bonding Apparatus for tape automated bonding

1992-06-26

1993-08-03

Ramsey, Kenneth J.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228219, B23K 302

Patent

active

052321444

ABSTRACT:
An improved TAB bond is achieved by an apparatus for tape automated bonding, comprising a thermode having a bonding surface. A shield is attached around the bonding surface. The shield is designed so that a nonoxidizing gas may be distributed in a bonding space defined by a plurality of tape leads on a tape positioned below the shield and a bonding area of a semiconductor chip positioned below the tape and the plurality of tape leads. In the bonding position the flow of the nonoxidizing gas removes substantially all of an ambient air in the bonding space.

REFERENCES:
patent: 4767047 (1988-08-01), Todd et al.
patent: 4979664 (1990-12-01), Lyons et al.
patent: 4984731 (1991-01-01), Imamura
patent: 5120391 (1992-06-01), Ishida

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