Apparatus for surface mounting flip chip carrier modules

Details Apparatus for surface mounting flip chip carrier modules Apparatus for surface mounting flip chip carrier modules

1995-05-25

1996-07-16

Sollecito, John M.

Drying and gas or vapor contact with solids

Apparatus

With means to treat gas or vapor

228 62, 228 8, 22818022, 29874, 29739, 34 80, F26B 2106

Patent

active

055355269

ABSTRACT:
A process for handling and storing surface-mount, encapsulated flip-chip carrier modules to prevent the formation of amoeba-like solder bridges between the flip-chip C4 connections along the boundary between the encapsulant and the chip surface and/or between the encapsulant and the chip carrier substrate surface. The concentration of free moisture in the encapsulant is maintained below a predetermined safe limit during reflow heating used to mount the modules on a circuit board.

REFERENCES:
patent: 3657790 (1972-04-01), Larrison
patent: 4836434 (1989-06-01), Takenaka et al.
patent: 4996939 (1991-03-01), D'Amato
patent: 5142873 (1992-09-01), Ramsey, Jr.

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