Apparatus for surface mounting an integrated circuit package

Details Apparatus for surface mounting an integrated circuit package Apparatus for surface mounting an integrated circuit package

1989-12-28

1991-04-09

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

361400, 361420, 439 72, H05K 702

Patent

active

050069624

ABSTRACT:
An apparatus for surface mounting an integrated circuit package onto a printed circuit board. Cantilever beams from a housing member extend inwardly toward a central opening and reside upon portion of the lead making contact to the printed circuit board. A tightening of the housing member onto the circuit board by retaining means causes the cantilever beam to provide a downward force to maintain lead contact to the electrical contact, as well as a sideward force for retaining the integrated circuit stationary.

REFERENCES:
patent: 4468074 (1984-08-01), Gordon
patent: 4878846 (1989-11-01), Schroeder

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