Apparatus for supporting wafer in semiconductor process

Details Apparatus for supporting wafer in semiconductor process Apparatus for supporting wafer in semiconductor process

2006-04-11

2006-04-11

Kackar, Ram N (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential etching apparatus including focus ring...

C156S345510, C156S345520, C156S345530, C118S715000, C118S728000, C118S725000, C118S724000, C204S298010, C204S192100, C216S067000, C279S128000, C361S234000, C438S710000

Reexamination Certificate

active

07025858

ABSTRACT:
The present invention provides an apparatus for supporting a wafer in a semiconductor process. The apparatus includes an electrostatic chuck, a focus ring and a conductive material. The electrostatic chuck has a first fillister in its periphery. When a DC power is applied to the electrostatic chuck, the wafer is attached tightly to the electrostatic chuck by electromagnetic force. The focus ring has a second fillister opposite to the first fillister, and the focus ring is fixed on the periphery of the electrostatic chuck. The conductive material is located below the focus ring, and the conductive material is moving between the first fillister and the second fillister by a drive apparatus. When the conductive material is moving close to the focus ring in semiconductor etching process, it can improve the etching uniformity of the wafer periphery.

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patent: 2004/0074605 (2004-04-01), Nezu et al.
patent: 02011781 (1990-01-01), None

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