Apparatus for supporting a heatsink

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C361S709000, C361S719000, C165S080300, C257S718000, C257S719000

Reexamination Certificate

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11324974

ABSTRACT:
Described is an apparatus for use supporting a heatsink thermally coupled to an integrated circuit component disposed on a first side of a circuit board. The heatsink has an opening that is aligned with an opening of the circuit board. The apparatus includes a support stud disposed beneath the heatsink on a second side of the circuit board. The support stud has a bore and is press fit into the opening of the circuit board from the second side and secured within the opening of the circuit board by a fastener passing through the aligned openings of the heatsink and the circuit board and into the bore. A capture mechanism, disposed on a surface adjacent and parallel to the second side of the circuit board, receives the support stud, thereby coupling the circuit board to the adjacent surface.

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patent: 2007/0064404 (2007-03-01), Dean

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