Apparatus for supporting a heatsink

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C361S709000, C361S719000, C165S080300, C257S718000, C257S719000

Reexamination Certificate

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07315449

ABSTRACT:
Described is an apparatus for use supporting a heatsink thermally coupled to an integrated circuit component disposed on a first side of a circuit board. The heatsink has an opening that is aligned with an opening of the circuit board. The apparatus includes a support stud disposed beneath the heatsink on a second side of the circuit board. The support stud has a bore and is press fit into the opening of the circuit board from the second side and secured within the opening of the circuit board by a fastener passing through the aligned openings of the heatsink and the circuit board and into the bore. A capture mechanism, disposed on a surface adjacent and parallel to the second side of the circuit board, receives the support stud, thereby coupling the circuit board to the adjacent surface.

REFERENCES:
patent: 5305185 (1994-04-01), Samarov et al.
patent: 6362978 (2002-03-01), Boe
patent: 6400577 (2002-06-01), Goodwin et al.
patent: 6545879 (2003-04-01), Goodwin
patent: 6549410 (2003-04-01), Cohen
patent: 6611431 (2003-08-01), Lee et al.
patent: 6937476 (2005-08-01), Chen et al.
patent: 7042727 (2006-05-01), Ulen et al.
patent: 7064957 (2006-06-01), Liang et al.
patent: 7110264 (2006-09-01), Chen et al.
patent: 7212400 (2007-05-01), Fan et al.
patent: 2006/0007659 (2006-01-01), Lee et al.
patent: 2006/0219385 (2006-10-01), Bell et al.
patent: 2006/0245165 (2006-11-01), Lin
patent: 2007/0064404 (2007-03-01), Dean

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