Apparatus for supplying power to a semiconductor device...

Details Apparatus for supplying power to a semiconductor device... Apparatus for supplying power to a semiconductor device...

2007-11-20

2009-08-25

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S765000, C361S785000, C361S306300

Reexamination Certificate

active

07580269

ABSTRACT:
A power shunt for use within a semiconductor device of a type having a motherboard and an integrated circuit package electrically coupled to the motherboard and of a type having a spaced portion located between the motherboard and the package. The power shunt comprises a capacitor within the spaced portion between the motherboard and the package of the semiconductor device. The capacitor includes a conductive layer of a first type, a conductive layer of a second type, and a dielectric layer that electrically isolates the first type conductive layer from the second type conductive layer, wherein said first type conductive layer and second type conductive layer form a conductive bridge between the motherboard and the package. The arrangement of the capacitor fulfills the dual function of providing decoupling capacitance with the capability of supplying an additional path of current between the motherboard and package to the die load.

REFERENCES:
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patent: 6446317 (2002-09-01), Figueroa et al.
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patent: 6461895 (2002-10-01), Liang et al.
patent: 6624444 (2003-09-01), Li
patent: 6907658 (2005-06-01), Li

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