Apparatus for subjecting a semiconductor substrate to a washing

Details Apparatus for subjecting a semiconductor substrate to a washing Apparatus for subjecting a semiconductor substrate to a washing

1995-03-10

1996-11-05

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

H01L 2100

Patent

active

055713670

ABSTRACT:
An apparatus for subjecting a semiconductor substrate to a washing process is equipped with a hermetically closable chamber for a substrate washing process and a washing process bath provided in the chamber to subject the substrate to the washing process. The semiconductor substrate is held in a horizontal state by a substrate support mechanism provided in the substrate washing process bath. A liquid supply mechanism is provided for supplying a liquid at least enough great to allow the semiconductor substrate to be immersed with the liquid. A chemicals liquid vapor and gas for substrate washing are supplied, by a chemicals component supply mechanism, into the chamber for a predetermined time period so that the chemicals liquid vapor and gas are dissolved into the liquid in the process bath to give a solution. The solution thus obtained is replaced by a pure water replacing mechanism with a specific liquid.

REFERENCES:
patent: 4840701 (1989-06-01), Stern

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