Apparatus for sticking nonconductive tape having plating perfora

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control

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Details

29829, 156252, 156324, 156513, 156629, B65H 2500

Patent

active

042643970

ABSTRACT:
Apparatus for sticking nonconductive tape including plating perforations to sheet metal comprises supply means for metal tape, feed means for nonconductive tape, punching means for perforating nonconductive tape to make plating perforations therein, a device for heating and pressure-sticking the metal tape and the perforated nonconductive tape together, cooling means for the tapes, and control means for monitoring the position of the plating perforations and controlling the running speed of the nonconductive tape.

REFERENCES:
patent: 2526568 (1970-09-01), Kepple et al.
patent: 2760290 (1956-08-01), Miller et al.
patent: 3518756 (1970-07-01), Bennett
patent: 3748205 (1973-07-01), Adams
patent: 3953274 (1976-04-01), Winrow et al.
patent: 4067760 (1978-01-01), Nelson

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