Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Patent
1984-07-11
1985-06-11
Wityshyn, Michael
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With cutting, punching, piercing, severing, or tearing
30310, 83490, 83455, 83564, 156267, 156523, 156576, 156577, 156579, B26D 126, B32B 3118
Patent
active
045226792
ABSTRACT:
An apparatus for semiautomatically sticking an adhesive film on a silicon wafer and on a ring used as a carrier. After the ring and the silicon wafer have been manually positioned on tables, an adhesive film is automatically stuck on the ring and the silicon wafer. The excess portion of the film is then cut by hand along the ring and transversely. The apparatus greatly facilitates these works.
REFERENCES:
patent: 1527763 (1925-02-01), Vance
patent: 2873789 (1959-02-01), Ditter et al.
patent: 3971691 (1976-07-01), Cairns
patent: 4050971 (1977-09-01), Verkins et al.
patent: 4060893 (1977-12-01), Matsuura
Ametani Minoru
Funakoshi Keigo
Nitto Electric Industrial Co. Ltd.
Wityshyn Michael
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