Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1995-03-21
1996-05-07
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257685, 257686, 257698, 257724, 361735, 361760, H01L 2334, H01L 2302, H01L 2304, H05K 700
Patent
active
055149073
ABSTRACT:
A multi-chip memory module comprises multiple standard, surface-mount-type memory chips stacked on top of each other, and a pair of printed circuit boards mounted on opposite sides of the memory chips to electrically interconnect the memory chips. Each printed circuit board has vias that are positioned to form multiple rows, with each row of vias used to connect the printed circuit board to a respective memory chip. The vias falling along the bottom-most row of each printed circuit board are also exposed and are used to surface mount the multi-chip module to pads of a memory board.
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Clark Jhihan
Crane Sara W.
Simple Technology Incorporated
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