Apparatus for sputtering cylinders

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118 33, 118218, 118320, 118416, 118503, C23C 1500

Patent

active

041510640

ABSTRACT:
Apparatus for sputtering printing or similar type cylinders by means of r.f. sputtering in which a cylindrical metal substrate is mounted on a mandrel which is installed in a sputtering chamber. The apparatus includes targets arranged around the cylindrical substrate, the substrate comprising the anode or being mounted on the anode. The sputtering operation is arranged to apply a highly uniform coating of a photoconductive material on the substrate and the structure is arranged so that the finished cylinder can be removed from the sputtering chamber along with the mandrel and replaced by another metal cylindrical substrate on another mandrel. In this way a printing cylinder comprising a seamless thin-walled metal sleeve having a coating of photoconductive material is easily produced economically and rapidly, said coating having uniform thickness and properties throughout.

REFERENCES:
patent: 2233070 (1941-02-01), Atwell et al.
patent: 2721535 (1955-10-01), Zitkus
patent: 3556004 (1971-01-01), Mitter et al.
patent: 3649502 (1972-03-01), Herte et al.
patent: 3650737 (1972-03-01), Maissel et al.
patent: 3818982 (1974-06-01), Wagner
patent: 4014779 (1977-03-01), Kuehnle

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for sputtering cylinders does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for sputtering cylinders, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for sputtering cylinders will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1989942

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.