Apparatus for solvent bonding non-porous materials to automatica

Pipe joints or couplings – With assembly means or feature – Molded joint facilitator

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

285 22, 285284, 285423, 285916, F16L 1302

Patent

active

055647529

ABSTRACT:
An apparatus which creates a pre-engineered solvent bond is disclosed which allows the bond characteristics of the resultant solvent bond to be predetermined. These characteristics can thus be chosen by the part designer with confidence that inherent variations in the assembly process will not unduly impact the resultant bond. The design establishes a specific volume through removable shims. Solvent added to this volume acts to dissolve material so that the predetermined bond characteristics are created.

REFERENCES:
patent: 2301664 (1942-03-01), Eggert
patent: 2500053 (1950-03-01), Andrews
patent: 3920787 (1975-10-01), McDowell et al.
patent: 4047739 (1977-09-01), Aitken
patent: 4137117 (1979-01-01), Jones
patent: 4140324 (1979-02-01), Mulas et al.
patent: 4181549 (1980-01-01), McPhee
patent: 4256333 (1981-03-01), Jones
patent: 4417753 (1983-11-01), Bacehowski et al.
patent: 4426243 (1984-01-01), Briggs et al.
patent: 4512947 (1985-04-01), Wyle et al.
patent: 4595446 (1986-06-01), Newkirk et al.
patent: 4651382 (1987-03-01), Krolick et al.
patent: 4810318 (1989-03-01), Haisma et al.
patent: 4816107 (1989-03-01), Collins et al.
patent: 4822443 (1989-04-01), Dubowik
patent: 4842305 (1989-06-01), Kistenich
patent: 4846909 (1989-07-01), Klug et al.
patent: 5125431 (1992-06-01), Vogel et al.
patent: 5203943 (1993-04-01), Nornberg et al.
patent: 5380048 (1995-01-01), Vogel
Malcolm W. Riley, "Joining & Fastening Plastics", Materials in Design Engineering, Jan. 1958, pp. 129-131.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for solvent bonding non-porous materials to automatica does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for solvent bonding non-porous materials to automatica, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for solvent bonding non-porous materials to automatica will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1240937

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.