Pipe joints or couplings – With assembly means or feature – Molded joint facilitator
Patent
1995-06-07
1996-10-15
Nicholson, Eric K.
Pipe joints or couplings
With assembly means or feature
Molded joint facilitator
285 22, 285284, 285423, 285916, F16L 1302
Patent
active
055647529
ABSTRACT:
An apparatus which creates a pre-engineered solvent bond is disclosed which allows the bond characteristics of the resultant solvent bond to be predetermined. These characteristics can thus be chosen by the part designer with confidence that inherent variations in the assembly process will not unduly impact the resultant bond. The design establishes a specific volume through removable shims. Solvent added to this volume acts to dissolve material so that the predetermined bond characteristics are created.
REFERENCES:
patent: 2301664 (1942-03-01), Eggert
patent: 2500053 (1950-03-01), Andrews
patent: 3920787 (1975-10-01), McDowell et al.
patent: 4047739 (1977-09-01), Aitken
patent: 4137117 (1979-01-01), Jones
patent: 4140324 (1979-02-01), Mulas et al.
patent: 4181549 (1980-01-01), McPhee
patent: 4256333 (1981-03-01), Jones
patent: 4417753 (1983-11-01), Bacehowski et al.
patent: 4426243 (1984-01-01), Briggs et al.
patent: 4512947 (1985-04-01), Wyle et al.
patent: 4595446 (1986-06-01), Newkirk et al.
patent: 4651382 (1987-03-01), Krolick et al.
patent: 4810318 (1989-03-01), Haisma et al.
patent: 4816107 (1989-03-01), Collins et al.
patent: 4822443 (1989-04-01), Dubowik
patent: 4842305 (1989-06-01), Kistenich
patent: 4846909 (1989-07-01), Klug et al.
patent: 5125431 (1992-06-01), Vogel et al.
patent: 5203943 (1993-04-01), Nornberg et al.
patent: 5380048 (1995-01-01), Vogel
Malcolm W. Riley, "Joining & Fastening Plastics", Materials in Design Engineering, Jan. 1958, pp. 129-131.
Nicholson Eric K.
Santangelo Luke
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