Apparatus for soldering workpieces

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid

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2281801, B23K 108

Patent

active

045401144

ABSTRACT:
An apparatus for soldering workpieces (29) has a main solder bath (20) with main solder wave (15) and the workpiece (29) is brought into contact with the surface of the main solder wave. The surface can be modulated by means of at least one additional solder outlet or inlet nozzle (11), in order to solder even densely packed circuit boards without problem and with complete wetting of all solder locations (FIG. 1).

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patent: 4285457 (1981-08-01), Kondo
patent: 4410127 (1983-10-01), Bodewig
patent: 4433805 (1984-02-01), Kanno
patent: 4447001 (1984-05-01), Allen et al.

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