Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1983-03-29
1985-09-10
Ramsey, Kenneth J.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
2281801, B23K 108
Patent
active
045401144
ABSTRACT:
An apparatus for soldering workpieces (29) has a main solder bath (20) with main solder wave (15) and the workpiece (29) is brought into contact with the surface of the main solder wave. The surface can be modulated by means of at least one additional solder outlet or inlet nozzle (11), in order to solder even densely packed circuit boards without problem and with complete wetting of all solder locations (FIG. 1).
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Jordan M.
Ramsey Kenneth J.
Zevatron GmbH Gesellschaft fur Fertigungseinrichtungen der Elekt
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