Apparatus for soldering solder on ceramic substrate

Details Apparatus for soldering solder on ceramic substrate Apparatus for soldering solder on ceramic substrate

1980-08-13

1982-11-09

Ramsey, Kenneth J.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 10, 228 565, B23K 2010, B23K 3702

Patent

active

043580440

ABSTRACT:
An apparatus for soldering a solder on a difficultly solderable substrate comprises a vibration tip which is rotatably held and is mounted on an ultrasonic oscillation mechanism and is slidably held to the vertical direction to an object for soldering. A needle part is placed in a predetermined distance and a predetermined direction from the edge of said vibration tip and said needle part is projected in substantially the same level as that of said edge of said vibration tip.

REFERENCES:
patent: 2990732 (1961-07-01), Ide
patent: 3610508 (1971-10-01), Laubmeyer
patent: 3628716 (1971-12-01), Fastre
patent: 3646307 (1972-02-01), Hazel
patent: 3661316 (1972-05-01), Kulicke, Jr. et al.
patent: 3757423 (1973-09-01), Wieg
patent: 3790738 (1974-02-01), Laub et al.
patent: 3960309 (1976-06-01), Hazel
patent: 4052793 (1977-10-01), Coughlin et al.

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