Apparatus for soldering components mounted at printed wiring boa

Metal fusion bonding – Process – Plural joints

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228 37, 228260, B23K 3102

Patent

active

042842255

ABSTRACT:
A conveyor device containing transport frames, each of which is structured for receiving a printed circuit or wiring board carrying circuit components and guided at their leading and their trailing corners by related guide tracks, leads the transport frames to a solder bath, where the transport device lowers the transport frames together with the printed circuit boards towards the solder bath and again raises the same therefrom. During the course of travel of a transport frame containing a printed circuit board carrying one or more of the circuit components through the solder bath one side of the printed circuit board is immersed into the solder bath and then again lifted out of the solder bath. On the one hand, to prevent that the connection leads or wires protruding from the printed circuit board, during the immersion into the soldering bath, hold back air and, on the other hand, to prevent that during lift-out of the printed circuit board from the solder bath solder bridges will form between the protruding leads or wires, the guide tracks, viewed in the direction of conveying, possess descending ramps whose spacing from one another is less than the length of a transort frame. Following the descending ramps are ascending ramps, whose spacing from one another approximately corresponds to the length of a transport frame. The equipment is particularly suitable for the series or mass production soldering of printed circuit boards which carry similar types of circuit components.

REFERENCES:
patent: 3732615 (1973-05-01), Fitzsimmons
patent: 3828419 (1974-08-01), Wanner
patent: 4171761 (1979-10-01), Boldt et al.

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