Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Patent
1992-11-09
1993-06-29
Seidel, Richard K.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Plural discrete workpieces
228 447, 228 20, B23K 304, B23K 3704
Patent
active
052226492
ABSTRACT:
An apparatus for bonding a semiconductor device onto a substrate (e.g., a printed circuit board) such that solder elements on the device are connected, respectively, to circuit elements on the substrate. The solder elements are heated by passing hot gas onto an opposing surface of the device such that, by heat transference, the solder elements become partially molten to form the desired connections. Pressure is also applied onto the device during this formation to assure planarity at the connection sites. Following formation, cooling of the connections is accomplished. By directing heated gas onto only the semiconductor device and not onto the solder element-circuit member locations (and thus onto the substrate), direct semiconductor device bonding to lower melting point temperature substrates (e.g., those circuit boards containing fiberglass reinforced epoxy resin as a dielectric) may be achieved.
REFERENCES:
patent: 4564135 (1986-01-01), Barresi et al.
patent: 4787548 (1988-11-01), Abbagnaro
patent: 4799617 (1989-01-01), Friedman
patent: 4844325 (1989-07-01), Nishiguchi et al.
patent: 4937006 (1990-06-01), Bickford et al.
patent: 4979664 (1990-12-01), Lyons et al.
IBM Technical Disclosure Bulletin, "Solder Reflow Tool", vol. 11, No. 10, Mar. 1969, p. 1298.
IBM Technical Disclosure Bulletin, "Hot Gas Gun", vol. 15, No. 3, Aug. 1972, pp. 822-823.
IBM Technical Disclosure Bulletin, "Robotic Hot Air Solder/Desolder Placement Device", vol. 30, No. 1, Jun. 1987, p. 114.
Surface Mount Technology, "How to Use Integral Vision and Reflow for Placement of Fine Pitch SMCs", Feb. 1987, pp. 31-32.
Funari Joseph
Moore Ronald J.
Elpel Jeanne M.
Fraley Lawrence R.
International Business Machines
Seidel Richard K.
LandOfFree
Apparatus for soldering a semiconductor device to a circuitized does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for soldering a semiconductor device to a circuitized , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for soldering a semiconductor device to a circuitized will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1749420