Apparatus for soldering a plurality of flat conductors on a boar

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By brush – wick – or pad

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228179, 228256, 228 52, B23K 112, B23K 302, B23K 3706

Patent

active

039412920

ABSTRACT:
An apparatus for soldering a plurality of flat conductors on a board consisting of a head with a soldering element and of a mechanism for relative displacement of the board and head. The soldering element has a working surface unwetted by the solder wherein, according to the invention, there is incorporated an elongated portion wetted by the solder and disposed at an angle to the line of relative displacement of the board and head. Said portion serves to spread the solder over each lead while being moved at a constant rate from lead to lead in succession.

REFERENCES:
patent: 2450860 (1948-10-01), Proffit
patent: 3529760 (1970-09-01), Hickman et al.

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