Apparatus for solder-plating a lead-frame carrying electronic co

Details Apparatus for solder-plating a lead-frame carrying electronic co Apparatus for solder-plating a lead-frame carrying electronic co

1991-05-07

1993-04-06

Wityshyn, Michael G.

Coating apparatus

Immersion or work-confined pool type

Capillary passages or barometric column feed

118407, 118429, 228 43, B05C 320, B05C 502

Patent

active

051999900

ABSTRACT:
An apparatus capable of solder-plating only on lead-regions of a lead-frame carrying a multiplicity of electronic parts or components. It comprises a block made of a heat-resistant and solder-wettable metal immersed in a bath of molten solder. The block is provided with a horizontal path for the lead-frame at a plane sufficiently above a level of said molten solder, and a plurality of vertical conduits, extending from the bottom of the block, open at the horizontal path. The conduits are capable of replenishing the molten solder on a plateau provided on a lower inside face of the path by capillary action. The lead-regions of lead-frame which travels through the path contacts with the molten solder on the plateau.

REFERENCES:
patent: 2673549 (1954-03-01), Frucki
patent: 2937108 (1960-05-01), Toye
patent: 3004505 (1961-10-01), Dvorak
patent: 4563976 (1986-01-01), Foell et al.

Affiliated with

Also associated with

Rating

Apparatus for solder-plating a lead-frame carrying electronic co does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for solder-plating a lead-frame carrying electronic co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for solder-plating a lead-frame carrying electronic co will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-533122