Apparatus for singling filled wafer slices

Details Apparatus for singling filled wafer slices Apparatus for singling filled wafer slices

1985-02-11

1987-06-02

Valenza, Joseph E.

Conveyors: power-driven

Conveyor system for establishing and moving a group of items

By shifting group from row conveyor onto row conveyor

198459, 1984635, B65G 4726

Patent

active

046696032

ABSTRACT:
When it is desired to single consecutive filled wafer slices, which are advanced with abutting trailing and leading faces, respectively, so that the singled wafer slices are ultimately spaced apart, a separation between consecutive wafer slices is to be effected in time even if the wafer slices are filled with cream so that their filling layers will strongly adhere to each other. This can be ensured in that a transfer device is provided between a feeding conveyor for advancing consecutive wafer slices abutting at their trailing and leading faces, respectively, and a delivering conveyor for advancing the rows of wafer slices on a delivery plane, which is vertically spaced from the feeding plane, on which the wafer slices are advanced by the feeding conveyor, and the transfer device pulls each leading wafer slice from the next succeeding wafer slice and moves the pulled-off wafer slice to the delivery plane.

REFERENCES:
patent: 2611470 (1952-09-01), Rudolph
patent: 3273691 (1966-09-01), Griner
patent: 3290974 (1966-12-01), Rowlands
patent: 3602358 (1971-08-01), Jakobsson
patent: 3866740 (1975-02-01), Greathead
patent: 4228888 (1980-10-01), Bruno
patent: 4372438 (1983-02-01), Hyashi

Affiliated with

Also associated with

Rating

Apparatus for singling filled wafer slices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for singling filled wafer slices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for singling filled wafer slices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-607088