Apparatus for simultaneous soldering of a plurality of devices

Details Apparatus for simultaneous soldering of a plurality of devices Apparatus for simultaneous soldering of a plurality of devices

1978-12-18

1980-11-18

Moon, Charlie T.

Metal fusion bonding

With means to handle work or product

Including means to orient work or position work portion...

269 41, 269903, B23K 112

Patent

active

042341183

ABSTRACT:
In making diode bridges 16, it is desirable to solder a plurality of such bridges simultaneously. To accomplish this a plurality of diodes 10 are held by a portion of one lead each in a cantilevered fashion in each of four in-line racks 38, 40, 50 and 52. The four racks 38, 40 50 and 52, with diodes 10 extending therefrom, are held at a fixed angle and fixed spacing with respect to each other to interleave the diode leads 14 and form channels. Solder wire 62 is placed in each of the channels. The diodes 10 and the solder wires 62 are then placed into either a heated gas or heated saturated vapor to melt the solder at the crosspoints 60 of the leads 14. Troughs 64 are provided adjacent the crosspoints 60 to catch any solder runoff which occurs during the melting.

REFERENCES:
patent: 1456506 (1923-05-01), Leveridge
patent: 2699133 (1955-01-01), Ames et al.
patent: 2859720 (1958-11-01), Palmer et al.
patent: 2887974 (1959-05-01), Weinfeld
patent: 3015576 (1962-01-01), Hendrixson
patent: 3286339 (1966-11-01), Kennard et al.
patent: 3310867 (1967-03-01), Ehrat et al.
patent: 3904102 (1975-09-01), Chu et al.
patent: 4074420 (1978-02-01), Lofdahl

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