Thermal measuring and testing – Housing – support – or adjunct
Reexamination Certificate
2006-07-07
2009-12-29
Verbitsky, Gail (Department: 2855)
Thermal measuring and testing
Housing, support, or adjunct
C374S179000, C374S029000, C374S043000, C374S152000, C324S765010
Reexamination Certificate
active
07637659
ABSTRACT:
Disclosed is an apparatus (10) for simulation of heat generation of a heat-generating electronic component. The apparatus includes a heat-transfer simulation device (110), a base (120) and at least one supporting post (150). The base is made of a heat-insulation material, and defines therein a recess (122). The heat-transfer simulation device is used for simulating heat generation from a heat-generating electronic component. The supporting post supportively mounts the heat-transfer simulation device within the recess defined in the base. A method of evaluating heat removal capacity of a heat dissipation device is also disclosed based on this apparatus.
REFERENCES:
patent: 5969949 (1999-10-01), Kim et al.
patent: 6663278 (2003-12-01), Chien et al.
patent: 6744269 (2004-06-01), Johnson et al.
patent: 6886976 (2005-05-01), Gaasch et al.
Liang Shang-Chih
Liu Tay-Jian
Foxconn Technology Co., Ltd.
Jagan Mirellys
Niranjan Frank R.
Verbitsky Gail
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