Apparatus for separating wafers from polishing pads used in chem

Abrading – Machine – Rotary tool

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

451286, 451287, 451288, 451289, 451921, 451388, B24B 500, B24B 2900

Patent

active

056581904

ABSTRACT:
The present invention is a planarizing machine for use in chemical-mechanical planarization of semiconductor wafers that has a moveable platen, a polishing pad, a wafer carrier, and a wafer separator. The polishing pad is positioned on the platen, and it has a planarizing surface with an operational zone upon which the wafer may be planarized. The wafer carrier holds a wafer and is positionable opposite the polishing pad to engage the wafer with the operational zone of the polishing pad. The wafer separator engages either the polishing pad, the wafer, or the wafer carrier to urge a portion of the wafer away from the pad.

REFERENCES:
patent: 4502252 (1985-03-01), Iwabuchi
patent: 5310455 (1994-05-01), Pasch et al.
patent: 5384986 (1995-01-01), Hirose
patent: 5398459 (1995-03-01), Okumura et al.
patent: 5403228 (1995-04-01), Pasch

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for separating wafers from polishing pads used in chem does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for separating wafers from polishing pads used in chem, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for separating wafers from polishing pads used in chem will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1100790

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.