Apparatus for separating wafers from polishing pads used in chem

Details Apparatus for separating wafers from polishing pads used in chem Apparatus for separating wafers from polishing pads used in chem

1995-12-15

1997-08-19

Rose, Robert A.

Abrading

Machine

Rotary tool

451286, 451287, 451288, 451289, 451921, 451388, B24B 500, B24B 2900

Patent

active

056581904

ABSTRACT:
The present invention is a planarizing machine for use in chemical-mechanical planarization of semiconductor wafers that has a moveable platen, a polishing pad, a wafer carrier, and a wafer separator. The polishing pad is positioned on the platen, and it has a planarizing surface with an operational zone upon which the wafer may be planarized. The wafer carrier holds a wafer and is positionable opposite the polishing pad to engage the wafer with the operational zone of the polishing pad. The wafer separator engages either the polishing pad, the wafer, or the wafer carrier to urge a portion of the wafer away from the pad.

REFERENCES:
patent: 4502252 (1985-03-01), Iwabuchi
patent: 5310455 (1994-05-01), Pasch et al.
patent: 5384986 (1995-01-01), Hirose
patent: 5398459 (1995-03-01), Okumura et al.
patent: 5403228 (1995-04-01), Pasch

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