Apparatus for separating cull of semiconductor package...

Details Apparatus for separating cull of semiconductor package... Apparatus for separating cull of semiconductor package...

2007-11-27

2007-11-27

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

Means to disassemble electrical device

C029S712000, C029S716000, C029S720000, C029S426400, C029S827000, C264S328400, C264S328190, C425S588000

Reexamination Certificate

active

10875477

ABSTRACT:
Disclosed is an apparatus for separating culls coupled to a lead frame when a semiconductor chip is molded. The apparatus includes a lower plate, on which culls coupled to a lead frame are placed, an upper plate pressing culls placed on the lower plate in order to separate culls from the lead frame, a pilot pin installed in the upper plate by passing through the upper plate in order to press culls together with the upper plate when the upper plate presses the culls, and a sensor unit installed adjacent to the movement path of the pilot pin so as to detect a movement of the pilot pin. When culls are separated, faults of articles caused by a molding material insufficiently filled in a mold are checked through detecting a movement of the pilot pin.

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