Apparatus for semiconductor manufacturing process

Details Apparatus for semiconductor manufacturing process Apparatus for semiconductor manufacturing process

2009-09-09

2010-12-07

Perkey, W. B. (Department: 2862)

Photography

Fluid-treating apparatus

Heating, cooling, or temperature detecting

C396S611000

Reexamination Certificate

active

07845868

ABSTRACT:
A semiconductor manufacturing process is provided. First, a wafer with a material layer and an exposed photoresist layer formed thereon is provided, wherein the wafer has a center area and an edge area. Thereafter, the property of the exposed photoresist layer is varied, so as to make a critical dimension of the exposed photoresist layer in the center area different from that of the same in the edge area. After the edge property of the exposed photoresist layer is varied, an etching process is performed to the wafer by using the exposed photoresist layer as a mask, so as to make a patterned material layer having a uniform critical dimension formed on the wafer.

REFERENCES:
patent: 6117778 (2000-09-01), Jones et al.
patent: 6599366 (2003-07-01), Kitano et al.
patent: 6695922 (2004-02-01), Kitano et al.
patent: 6753508 (2004-06-01), Shirakawa
patent: 7566181 (2009-07-01), Yang et al.
patent: 2003/0001267 (2003-01-01), Watanabe
patent: 2003/0045121 (2003-03-01), Higashi
patent: 2003/0077083 (2003-04-01), Yamamoto et al.
patent: 2003/0114009 (2003-06-01), Kim et al.
patent: 2004/0067654 (2004-04-01), Chen et al.
patent: 2005/0284576 (2005-12-01), America et al.
patent: 2007/0003279 (2007-01-01), Park
patent: 2008/0241778 (2008-10-01), Kulp
“2nd Office Action of DE counterpart application”, notified on May 11, 2010, p. 1-7, with English Translation included.

Affiliated with

Also associated with

Rating

Apparatus for semiconductor manufacturing process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for semiconductor manufacturing process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for semiconductor manufacturing process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4186192