Apparatus for semiconductor chip detachment

Details Apparatus for semiconductor chip detachment Apparatus for semiconductor chip detachment

2007-07-10

2007-07-10

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

Means to disassemble electrical device

C029S721000, C029S743000, C029S832000, C029S426100, C156S583200

Reexamination Certificate

active

10843826

ABSTRACT:
An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved.

REFERENCES:
patent: 4296542 (1981-10-01), Gotman
patent: 4778362 (1988-10-01), Hoffmann
patent: 6123800 (2000-09-01), Freund
patent: 6165310 (2000-12-01), Freund
patent: 6202292 (2001-03-01), Farnworth
patent: 6290805 (2001-09-01), Freund
patent: 6386815 (2002-05-01), Tawara
patent: 6505395 (2003-01-01), Farnworth
patent: 6555418 (2003-04-01), Kurosawa
patent: 6561743 (2003-05-01), Nakatsu
patent: 6629553 (2003-10-01), Odashima
patent: 6658718 (2003-12-01), Farnworth
patent: 6889427 (2005-05-01), Yee et al.

Affiliated with

Also associated with

Rating

Apparatus for semiconductor chip detachment does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for semiconductor chip detachment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for semiconductor chip detachment will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3732825