Apparatus for selectively plating lead frames

Details Apparatus for selectively plating lead frames Apparatus for selectively plating lead frames

1975-11-03

1977-07-05

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204 15, 204206, C25D 502, C25D 510, C25D 706

Patent

active

040338444

ABSTRACT:
A novel plated lead frame strip and a novel method and apparatus for selectively plating the strip is described. The strip comprises a plurality of identical lead frame sections. Each of the lead frame sections comprises a plurality of leads. Each lead has a lead tip. In the center of each section and surrounded by the lead tips is a die-attach pad. The apparatus comprises in combination three plating stations. Each of the three stations is provided for plating a predetermined part of each of the lead frame sections. In the first station, a means is provided for plating the tips and the pad of a lead frame section with a first predetermined metallic plating -- e.g., a gold or copper strike. In the second station, a means is provided for masking the tips and plating the pad only with a second predetermined metallic plating -- e.g., a gold finish. In the third station, a means is provided for masking the pad and plating the tips with a third predetermined metallic plating -- e.g., silver. The stations are arranged in such a fashion that all three may be plating simultaneously with each one plating its respective part in the desired plating sequence.

REFERENCES:
patent: 3644181 (1972-02-01), Donaldson
patent: 3723283 (1973-03-01), Johnson et al.
patent: 3745105 (1973-07-01), Kosowsky et al.
patent: 3763027 (1973-10-01), Pearson et al.
patent: 3860499 (1975-01-01), Graham et al.

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