Apparatus for selectively electroplating apertured metal or meta

Details Apparatus for selectively electroplating apertured metal or meta Apparatus for selectively electroplating apertured metal or meta

1994-01-27

1996-04-30

Niebling, John

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204203, 204224R, 204622, 204624, 205128, C25D 502

Patent

active

055121543

ABSTRACT:
The invention relates to an apparatus for selectively electroplating apertured products. The products are masked in accordance with the intended plating and subsequently exposed to an electrolyte in order to electroplate the products. For masking purposes a fully closed photoresist layer is electrophoretically applied to the products, and after drying of the photoresist layer, the products are covered with a photomask in accordance with the locations to be plated, after which exposure takes place. Then the photoresist layer is partially removed, while the remaining part of the photoresist layer remains behind on the products, to serve as a mask for the metal products upon electroplating.

REFERENCES:
patent: 3819502 (1974-06-01), Meuldijk et al.
patent: 3855108 (1974-12-01), Bolz et al.
patent: 4376017 (1983-03-01), Urion
patent: 4404079 (1983-09-01), Jahani
patent: 4411982 (1983-10-01), Shibuya et al.
patent: 4493757 (1985-01-01), Piepers
patent: 5183724 (1993-02-01), Johnson

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