Apparatus for selectively applying solder paste to multiple type

Details Apparatus for selectively applying solder paste to multiple type Apparatus for selectively applying solder paste to multiple type

1994-05-05

1995-09-26

Burr, Edgar S.

Printing

Stenciling

Stencil and work support

101 44, 101484, 101DIG30, 209939, B41F 1508, B41F 1700

Patent

active

054526566

ABSTRACT:
According to the present invention, a screen printer (200) selectively applies solder paste to multiple types of printed circuit boards. The screen printer (200) includes mobile placement equipment (210), which receives and transports the boards, and application equipment, which includes first and second stencils (225), frames for holding the stencils (225) in fixed positions, and an applicator (415) for applying solder paste to a board through either the first or second stencil (225). A controller (215) determines the type of a board received by the mobile placement equipment (210), then, when the board is of a first type, directs the mobile placement equipment (210) to a location aligned with the first stencil. When the board is of a second type, the mobile placement equipment (210) is directed to a location aligned with the second stencil.

REFERENCES:
patent: 4976356 (1990-12-01), Mizuno et al.
patent: 5176078 (1993-01-01), Homma et al.
patent: 5226361 (1993-07-01), Grant et al.

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