Apparatus for selective electroplating of workpieces

Details Apparatus for selective electroplating of workpieces Apparatus for selective electroplating of workpieces

1977-07-22

1978-11-21

Mack, John H.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204225, 204297R, C25D 1700, C25D 1706

Patent

active

041265335

ABSTRACT:
The apparatus comprises a plating unit, the cavity of which communicates with a plating solution feed system, and pressing means mounted above the plating unit. The pressing means according to the invention is made in the form of a magazine with two or more pressure surfaces whereon sealing members, workpiece orientation members and workpiece retaining members are mounted. The magazine is operatively connected to a vertical movement actuator in a manner which provides for rotation of the magazine about its horizontal axis. A masking member is mounted on the surface of the plating unit to mask the workpiece surface areas not to be plated. The apparatus comprises an anode which is mounted in the internal space or cavity of the plating unit in the path of the plating solution flowing towards the workpiece, and a cathode connected to the workpiece.
The apparatus ensures a higher efficiency of the plating process, due to the fact that simultaneously with the plating of workpieces pressed between the plating unit surface and one of the pressure surfaces of the magazine it is possible to remove plated workpieces from and place the next lot of workpieces to be plated onto the other pressure surface.

REFERENCES:
patent: 2828256 (1958-03-01), Gempe
patent: 3745105 (1973-07-01), Kosowsky et al.
patent: 3752755 (1973-08-01), Krafft
patent: 3763027 (1973-10-01), Pearson
patent: 4029564 (1977-06-01), Higuchi et al.
patent: 4030999 (1977-06-01), Allen

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