Apparatus for selecting high-reliability integrated circuits

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Details

C324S760020, C324S765010, C439S065000, C439S074000

Reexamination Certificate

active

06218850

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an apparatus for testing integrated circuits, and more particularly, to an apparatus for selecting high-reliability integrated circuits.
2. Description of the Prior Art
FIG.
1
(profile) shows a known apparatus provided for selecting high-reliability integrated circuits in the testing environment. The pattern board
12
and the feedthrough card
13
are placed within the room temperature
10
while the main board
14
, the daughter cards
15
, the sockets
16
supporting the integrated circuits and the conductors
17
like needle are placed within the oven
11
. In order to keep the integrated circuits the quality of high reliability, a burn-in testing must be done. The apparatus serves to induce accelerated aging of the integrated circuits and failure of those integrated circuits which are not capable of withstanding the stresses applied, such as higher temperature, during the test.
Because the sockets
16
cannot be removed from the main board
14
, the main board
14
must be modified or redesigned when integrated circuits of various packages are tested. That is to say, different package of integrated circuits correspond to different main boards
14
with different socket(s). And the main board
14
is rather a large-sized printed circuit board, so this increases the cost for testing. Furthermore, the known apparatus cannot provide enough testing signals and ground pins for high pin count products. For the foregoing reason, there is a need for the structural apparatus of the present invention.
SUMMARY OF THE INVENTION
In accordance with the present invention, an apparatus is provided for selecting high-reliability integrated circuits. The apparatus includes pattern boards, feedthrough cards, a main board, a signal board, a plurality of daughter cards, a plurality of socket cards and a plurality groups of conductors like needle in rows. The integrated circuits are supported by sockets in the socket cards. The apparatus is placed within an oven except the pattern boards and the feedthrough cards to do a burn-in testing for selecting high-reliability integrated circuits. When the apparatus includes two pattern boards and two feedthrough cards, one pattern board, one feedthrough card and the main board all lie in the same plane and then the other pattern board, the other feedthrough card and the signal board all lie in another same plane. The signal board, the daughter cards and the socket cards can be removed from the apparatus.
The pattern boards provide testing signals. And then the testing signals are amplified. The feedthrough cards are used to direct the testing signals into the main board and the signal board. Then the signals pass through electronic circuits in the main board and electronic circuits in the signal board. Moreover, the signals are sent to electronic circuits in the plurality of daughter cards via some groups of conductors like needle in rows. Finally, the testing signals are sent to the tested integrated circuits in the plurality of socket cards via some groups of conductors like needle in rows.


REFERENCES:
patent: 5672981 (1997-09-01), Fehrman
patent: 6072326 (2000-06-01), Akram

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