Apparatus for segmenting stacked IC chips

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156344, 156584, 219521, H05B 300

Patent

active

054323185

ABSTRACT:
A tool for segmenting a stack of bonded IC chips into short stacks includes a heat conducting base having at least one cavity in its upper face for receiving a portion of an IC chip stack. The length and width dimensions of the cavity are essentially the same as the corresponding dimensions of the stack. The depth of the cavity is selected to correspond to the desired thickness of the short stack to be formed from the stack. The base is heated to raise the temperature of the cavity walls to heat the stack above the softening point of the bonding material. A driver is movably mounted on the base for contact with a portion of a face of the stack extending above the opening of the cavity, and a threaded rod supported on the base urges the driver against the stack to effect separation of the extending portion of the stack from the segment portion which remains in the cavity. A track in the upper surface of the base is provided for travel of the driver.

REFERENCES:
patent: 4811861 (1484-03-01), Roberts
patent: 5240546 (1993-08-01), Shiga

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for segmenting stacked IC chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for segmenting stacked IC chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for segmenting stacked IC chips will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-504678

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.