Apparatus for securing tape to leads of semiconductor lead frame

Details Apparatus for securing tape to leads of semiconductor lead frame Apparatus for securing tape to leads of semiconductor lead frame

1979-11-02

1981-07-21

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With electrical controls

156261, 156515, 156518, 156519, 1565831, B32B 3100

Patent

active

042796822

ABSTRACT:
An apparatus for securing a tape to leads of a semiconductor lead frame, includes, a tape feeder, a punch for punching the tape and for pressing the punched tape against the lead frame, a mechanism for horizontally moving the lead frame and setting it in the punch and the press, and a mechanism for adjusting the timing of the feeder, the punch, the press and the moving mechanism. The punch and the press include a fixed upper die on which the lead frame rests and in which the tape is supported, the punch being movable against the tape for punching out a portion of the tape and for pressing it against the lead frame.

REFERENCES:
patent: 1628338 (1927-05-01), Skov
patent: 2441164 (1948-05-01), Miller
patent: 2543678 (1951-02-01), Tumulo
patent: 3047053 (1962-07-01), Howard
patent: 3195180 (1965-07-01), Jagger et al.
patent: 3597816 (1971-08-01), Zelenz
patent: 3711625 (1973-01-01), Dupuis
patent: 3784439 (1974-01-01), Dorman

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