Apparatus for sealing a semiconductor package having frosted qua

Details Apparatus for sealing a semiconductor package having frosted qua Apparatus for sealing a semiconductor package having frosted qua

1991-06-11

1992-12-22

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With means applying wave energy or electrical energy...

437215, 1563798, 156538, 156578, B27G 1102

Patent

active

051731479

ABSTRACT:
An apparatus for sealing a semiconductor package, which is used for performing a sealing operation, includes a unit for emitting ultraviolet rays, and a package base having an entrance surface and an exit surface. The package base between the entrance surface and the exit surface is made of quartz glass. The emitting means closely contacts the entrance surface. And ultraviolet rays emitting by the emitting unit are applied through the quartz glass to the semiconductor package which is mounted on the exit surface.

REFERENCES:
patent: 4072552 (1978-02-01), Ewing
patent: 4193694 (1980-03-01), Smith
patent: 4418284 (1983-11-01), Ogawa et al.
patent: 4661191 (1987-04-01), Kamio et al.
patent: 4685200 (1987-08-01), Bokil
patent: 4976802 (1990-12-01), LeBlanc
Hackh's Chemical Dictionary, 4th ed., McGraw-Hill Book Co., 1969, p. 298.

Affiliated with

Also associated with

Rating

Apparatus for sealing a semiconductor package having frosted qua does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for sealing a semiconductor package having frosted qua, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for sealing a semiconductor package having frosted qua will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-973103