Severing by tearing or breaking – Breaking or tearing apparatus – Combined with preliminary weakener or with nonbreaking cutter
Patent
1996-04-03
1998-10-13
Jones, Eugenia
Severing by tearing or breaking
Breaking or tearing apparatus
Combined with preliminary weakener or with nonbreaking cutter
225 965, 225103, 83882, B26F 300
Patent
active
058200061
ABSTRACT:
Apparatus for automatic scribing and breaking of semiconductor wafers wherein scribing is performed at a scribing station and the scribed wafer transported in the X direction to a breaking station on an X-Y table. Scribing and breaking of parallel lines is accomplished by transporting the wafer step-wise in the Y direction by the Y table. Rotation of the wafer for scribing and breaking along sets of lines perpendicular to one another is accomplished by a theta table carried on the Y table. An impulse bar is carried by the X table for applying force to the bottom surface of the wafer during both scribing and breaking. In one embodiment, upward movement of the wafer during breaking is resisted by an anvil positioned above the wafer. In a second embodiment, such upward movement is resisted by a vacuum chuck beneath the wafer, to avoid contact with the upper wafer surface. Scribing and breaking parameters needed to scribe and break the wafer are entered into computer memory and operated upon by computer controls to automate the scribing and/or breaking process. In one embodiment, scribing and breaking of a single wafer is carried out continuously on the same apparatus without operator intervention.
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Dynatex International, Inc.
Jones Eugenia
LandOfFree
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