Apparatus for rinsing wafers adhered with chemical liquid by use

Details Apparatus for rinsing wafers adhered with chemical liquid by use Apparatus for rinsing wafers adhered with chemical liquid by use

1997-04-17

1999-03-16

Stinson, Frankie L.

Cleaning and liquid contact with solids

Apparatus

With plural means for supplying or applying different fluids...

134155, 134186, 134902, B08B 304

Patent

active

058817484

ABSTRACT:
A method for rinsing wafers having residual chemical liquid adhering thereto with purified water is disclosed which is characterized by the steps of preparing a rinsing tank provided in the upper part thereof with an overflow discharge part for spent rinsing liquid and a head tank disposed above the rinsing tank, storing purified water for rinse in the head tank, setting in place in the rinsing tank a basket having a plurality of wafers stowed therein parallelly as suitably spaced in such a manner that the surfaces of the wafers may lie substantially vertically, feeding the purified water from the headtank to the rinsing tank by virtue of head, causing the purified water to flow upward from below the basket, and enabling the spent rinsing liquid to be discharged through the overflow discharge part in an amount equivalent to part or the whole of the purified water fed from the head tank.

REFERENCES:
patent: 4997490 (1991-03-01), Vetter
patent: 5069235 (1991-12-01), Vetter
patent: 5088510 (1992-02-01), Bannon
patent: 5488964 (1996-02-01), Murakami et al.
IBM Technical Disclosure Bulletin, vol. 32, No. 3A, Aug. 1989, "Acetic Acid Spray Rinse for Removing Developed Resist Residuals from a Wafer Surface" Aug. 1981.

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