Apparatus for restricting moisture ingress

Details Apparatus for restricting moisture ingress Apparatus for restricting moisture ingress

2009-09-29

2011-12-06

Graybill, David (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000

Reexamination Certificate

active

08072056

ABSTRACT:
Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.

REFERENCES:
patent: 3388301 (1968-06-01), James
patent: 3943557 (1976-03-01), Frazee et al.
patent: 4224565 (1980-09-01), Sosniak et al.
patent: 4285002 (1981-08-01), Campbell
patent: 4684884 (1987-08-01), Soderlund
patent: 4773972 (1988-09-01), Mikkor
patent: 4775831 (1988-10-01), Annamalai
patent: 4868712 (1989-09-01), Woodman
patent: 4870224 (1989-09-01), Smith et al.
patent: 5059899 (1991-10-01), Farnworth et al.
patent: 5315486 (1994-05-01), Fillion et al.
patent: 5381039 (1995-01-01), Morrison
patent: 5381804 (1995-01-01), Shambroom
patent: 5572065 (1996-11-01), Burns
patent: 5592391 (1997-01-01), Muyshondt et al.
patent: 5606264 (1997-02-01), Licari et al.
patent: 5682065 (1997-10-01), Farnworth et al.
patent: 5938956 (1999-08-01), Hembree et al.
patent: 5955789 (1999-09-01), Vendramin
patent: 6022787 (2000-02-01), Ma
patent: 6032064 (2000-02-01), Devlin et al.
patent: 6074891 (2000-06-01), Staller
patent: 6297072 (2001-10-01), Tilmans et al.
patent: 6297551 (2001-10-01), Dudderar et al.
patent: 6298255 (2001-10-01), Cordero et al.
patent: 6303977 (2001-10-01), Schroen et al.
patent: 6323550 (2001-11-01), Martin et al.
patent: 6394953 (2002-05-01), Devlin et al.
patent: 6486534 (2002-11-01), Sridharan et al.
patent: 6500694 (2002-12-01), Enquist
patent: 6514798 (2003-02-01), Farnworth
patent: 6515870 (2003-02-01), Skinner et al.
patent: 6516808 (2003-02-01), Schulman
patent: 6555856 (2003-04-01), Staller
patent: 6563133 (2003-05-01), Tong
patent: 6566596 (2003-05-01), Askew
patent: 6566736 (2003-05-01), Ogawa et al.
patent: 6638784 (2003-10-01), Bartlett et al.
patent: 6696369 (2004-02-01), Fraser et al.
patent: 6718206 (2004-04-01), Casavant
patent: 6774327 (2004-08-01), Wong
patent: 6822326 (2004-11-01), Enquist et al.
patent: 6867073 (2005-03-01), Enquist
patent: 6902987 (2005-06-01), Tong et al.
patent: 6903918 (2005-06-01), Brennan
patent: 6962835 (2005-11-01), Tong et al.
patent: 7096580 (2006-08-01), Gonzalez et al.
patent: 7109092 (2006-09-01), Tong
patent: 7205181 (2007-04-01), MacIntyre
patent: 7238999 (2007-07-01), LaFond et al.
patent: 7247517 (2007-07-01), Rumer et al.
patent: 7759774 (2010-07-01), Fraser et al.
patent: 2004/0222478 (2004-11-01), Zhang et al.
patent: 2005/0009246 (2005-01-01), Enquist et al.
patent: 2005/0065565 (2005-03-01), Kramer et al.
patent: 2006/0033204 (2006-02-01), Fraser et al.
patent: 2006/0264004 (2006-11-01), Tong et al.
patent: 2007/0037379 (2007-02-01), Enquist et al.
patent: 2007/0251338 (2007-11-01), Wiese et al.
U.S. Appl. No. 12/569,431, filed Sep. 29, 2009, Gerrish et al.
U.S. Appl. No. 12/569,474, filed Sep. 29, 2009, Fenner et al.
U.S. Appl. No. 12/569,525, filed Sep. 29, 2009, Mueller et al.
Lea et al., “DRIE from MEMS to wafer-level packaging,”Solid State Technology, Dec. 2007; 50(12), 8 pgs. Retrieved online on Oct. 11, 2010. Available online at <url:http://www.electroiq.com/ElectroIQ/en-us/index/display/Semiconductor—Article—Tools—Template.articles.solid-state-technology.volume-50.issue-12.features.mems.drie-from-mems-to-wafer-level-packaging.html>.
Pham et al., “High-aspect-ratio bulk micromachined vias contacts,” ProcSAFE & Prorisc 2004, Veldhoven, NL, Nov. 25-26, 2004 , pp. 742-746.

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