Apparatus for replacing defective electronic components

Details Apparatus for replacing defective electronic components Apparatus for replacing defective electronic components

1990-08-03

1991-07-09

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 13, 228119, B23K 300, H01L 2160

Patent

active

050297473

ABSTRACT:
A method of replacing a defective electronic component having a plurality of electrical leads bonded to electrical contacts on a support by cutting leads adjacent the bond site, rebonding the stubs to the contacts, replacing the defective component and bonding the leads of the replacement component to the electrical contacts. Preferably, the leads are cut simultaneously with the rebonding of the stubs. The leads may be bonded to the top of the stub or to the side of the stub. A bonding tool is provided for simultaneously cutting a lead and rebonding the resultant stub.

REFERENCES:
patent: 3648354 (1972-03-01), Mashino et al.
patent: 4049334 (1977-09-01), Siden
patent: 4415115 (1983-11-01), James
patent: 4619397 (1986-10-01), Urban
patent: 4645118 (1987-02-01), Biggs et al.
patent: 4776509 (1988-10-01), Pitts et al.

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